电子封装失效分析

内容简介： Category Course Title Content 类别 培训内容 课程内容 QFA1: • 电子封装简介 Brief introduction of electronic package Failure Analysis on Electronic Packaging • 失效定义及分类 Definition and classification of failures • 电子产品为何失效 Why do electronic products fail • 失效分析的目标 The objectives of failure analysis 电子封装失效分析 • 失效分析的重要性 Understand the importance of failure analysis • 失效分析的思想方法 Philosophical approach of failure analysis 0.5 day • 失效分析技术线路 0.5 天 Technique approach of failure analysis • 失效分析流程 Failure analysis flow charts • 元器件典型失效模式和机理 Typical failure modes and failure mechanisms of electronics components QFA2: • 产品可靠性浴盆曲线 Reliability Tests and Qualification of Plastic Packaged Ics Product reliability and bathtub curve • 筛选试验，可靠性试验，可靠性认证 Screening tests, reliability tests, qualification tests • 常见可靠性试验、目的、诱导的典型失效模式及机理等 可靠性试验及封装认证 Common reliability tests, objectives, typical failure modes and mechanisms • 典型集成电路塑料封装器件的封装认证标准简介 0.5 day Typical standards on package qualification of plastic packaged ICs 0.5 天 • 器件结构分析 Package construction analysis QFA3: • 塑料封装器件中的水汽扩散、回流焊接过程中湿气蒸发引起 的分层、爆裂等失效现象 Moisture Sensitivity and Relevant Issues Moisture diffusion in plastic packages, moisture induced failure modes such as delamination, popcorn crack, etc. • 器件湿气敏感性分级：JESD020C:非气密性表面封装固态电路的水汽/回流敏感性等级 Moisture sensitivity level: JESD020C: Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices 塑料封装器件的潮气敏感性及相关问题 • 如何判断与湿气敏感性相关的失效的根本原因：器件质量还是电子组装？ 0.5 day How to judge the root cause when popcorn crack happens: device quality or SMT problem? 0.5 天 • 器件怀疑吸湿如何处理：实用指南 What to do, if your devices are susceptible of excessive moisture absorption: a practical guide QFA4: • 焊接界面形成 Solidification and interface intermetallics formation Soldering & Solder Joint Failure Analysis • 电子产品服役过程中焊料组织及界面金属间化合物的演化及其与焊点失效的关系 Evolution of solder micro-structure and interface intermetallics and effects on solder joint lifetime 焊接及焊点失效分析 • 影响焊点寿命的典型设计、工艺、材料等因素 0.5 day Typical design, material, process parameters affecting soldering joint lifetime 0.5 天 • 焊点失效分析流程 Typical flow chart for solder joint failure analysis • 焊点失效典型模式及分析方法 Typical failure modes and analysis method 培训讲师：张群博士 2001年毕业于*科上海微系统与信息技术研究所，材料物理博士。曾任职上海新代车辆技术有限公司电子封装和质量中心部项目经理和技术经理；现任职于某*公司失效分析实验室经理。在电子产品可靠性和失效分析领域具有丰富的经验，从事研究和技术服务10年以上，竭诚为您答疑。