内容简介：
目录
Catalog
培训内容/时间
Course Title
课程内容
Content
失效分析
Failure analysis
常用失效分析流程和工具
Failure analysis and tools
1天
1day
· 失效定义及分类 Definition and classification of failures
· 电子产品为何失效 Why do electronic products fail?
· 失效分析的目标 The objectives of failure analysis
· 失效分析的重要性 Understand the importance of failure analysis
· 失效分析的思想方法 Philosophical approach of failure analysis
· 失效分析技术线路 Technique approach of failure analysis
· 失效分析流程 Failure analysis flow charts
· 常用失效分析无损检测工具 Nondestructive analysis tools for failure analysis
· 常用失效分析物理解剖和定位工具Destructive analysis tools and failure isolation tools
失效分析
Failure analysis
电子封装失效分析
Electronic package and failure analysis
0.5天
0.5 day
· 失效定义及分类 Definition and classification of failures
· 电子产品为何失效 Why do electronic products fail?
· 失效分析的目标 The objectives of failure analysis
· 失效分析的重要性 Understand the importance of failure analysis
· 失效分析的思想方法 Philosophical approach of failure analysis
· 失效分析技术线路 Technique approach of failure analysis
· 失效分析流程 Failure analysis flow charts
· 解决问题的8D方法 Eight disciplines (8D) in problem solving
· 元器件典型失效模式和机理 Typical failure modes and failure mechanisms of electronics components
· 典型封装产品失效分析案例 Case study for electronic package failure analysis
失效分析
Failure analysis
Soldering & Solder Joint Failure Analysis
焊接及焊点失效分析
0.5 天
0.5 day
· 失效定义及分类 Definition and classification of failures
· 电子产品为何失效 Why do electronic products fail?
· 失效分析的目标 The objectives of failure analysis
· 失效分析的重要性 Understand the importance of failure analysis
· 失效分析的思想方法 Philosophical approach of failure analysis
· 失效分析技术线路 Technique approach of failure analysis
· 失效分析流程 Failure analysis flow charts
· 解决问题的8D方法 Eight disciplines (8D) in problem solving
· 焊点失效分析流程 Typical flow chart for solder joint failure analysis
· 焊点失效典型模式及分析方法 Typical failure modes and analysis method
· 典型焊点失效分析案例 Case study for solder joint failure analysis
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