目录
Catalog 培训内容/时间
Course Title 课程内容
Content
可靠性
Reliability 可靠性、质量认证及测试
Reliability, Qualification and test
0.5 天
0.5 day • 微电子器件及微系统简介Brief introduction of microelectronic devices and micro-electronic systems
• 可靠性描述和浴盆曲线 Reliability description and bathtub curve
• 常见可靠性模型和加速因子估算 Common reliability model and active factor estimation
• 可靠性试验和认证 Typical reliability tests
• 器件结构分析 Package construction analysis
可靠性
Reliability 塑料封装器件的潮气敏感性及相关问题
Moisture Sensitivity and Relevant Issues
0.5 天
0.5 day • 塑料封装器件中的水汽扩散、回流焊接过程中湿气蒸发引起的分层、爆裂等失效现象 Moisture diffusion in plastic packages, moisture induced failure modes such as delamination, popcorn crack, etc.
• 器件湿气敏感性分级：JESD020: 非气密性表面封装固态电路的水汽/回流敏感性等级 Moisture sensitivity level: JESD020: Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
• 如何判断与湿气敏感性相关的失效的根本原因：器件质量还是电子组装？How to judge the root cause when popcorn crack happens: device quality or SMT problem?
• 器件怀疑吸湿如何处理：实用指南 What to do, if your devices are susceptible of excessive moisture absorption: a practical guide
可靠性
Reliability 电子器件静电防护和过电损伤
ESD and EOS
0.5 天
0.5 day • 静放电/电过应力基本概念介绍 ESD/EOS definition and distinguish
• 器件/系统静放电评估和实验方法 Component level ESD while system level ESD evaluation and test
• 静放电控制和检查 Typical ESD control and checklist in manufacture process
• 电过应力预防和根因分析难点 Typical EOS prevention and challenge of root cause identification
• 典型案例 Case study
可靠性
Reliability 器件焊接性能评价方法及标准
Test method and standard for component solderability evaluation
0.5 天
0.5 day • 无铅焊相关的常见标准 Common standards for lead free soldering
• 无铅焊的润湿性评价试验 Solderability tests and evaluation for lead free soldering
• 无铅焊点强度试验方法 Testing of solder joint strength for lead free soldering
• 无铅焊点寿命机械试验方法 Lead free solder joint lifetime test with mechanical method
