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内容简介：
• 电子封装简介Brief introduction of electronic package
• 失效定义及分类Definition and classification of failures
• 电子产品为何失效Why do electronic products fail?
• 失效分析的目标The objectives of failure analysis
• 失效分析的重要性Understand the importance of failure analysis
• 失效分析的思想方法Philosophical approach of failure analysis
• 失效分析技术线路Technique approach of failure analysis
• 失效分析流程Failure analysis flow charts
• 元器件典型失效模式和机理Typical failure modes and failure mechanisms of electronics components
• 产品可靠性浴盆曲线Product reliability and bathtub curve
• 筛选试验，可靠性试验，可靠性认证Screening tests, reliability tests, qualification tests
• 常见可靠性试验、目的、诱导的典型失效模式及机理等Common reliability tests, objectives, typical failure modes and mechanisms
• 典型集成电路塑料封装器件的封装认证标准简介Typical standards on package qualification of plastic packaged ICs
• 器件结构分析Package construction analysis
• 塑料封装器件中的水汽扩散、回流焊接过程中湿气蒸发引起的分层、爆裂等失效现象 Moisture diffusion in plastic packages, moisture induced failure modes such as delamination, popcorn crack, etc.
• 器件湿气敏感性分级：JESD020C:非气密性表面封装固态电路的水汽/回流敏感性等级 Moisture sensitivity level: JESD020C: Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
• 如何判断与湿气敏感性相关的失效的根本原因：器件质量还是电子组装？How to judge the root cause when popcorn crack happens: device quality or SMT problem?
• 器件怀疑吸湿如何处理：实用指南 What to do, if your devices are susceptible of excessive moisture absorption: a practical guide
• 焊接界面形成 Solidification and interface intermetallics formation
• 电子产品服役过程中焊料组织及界面金属间化合物的演化及其与焊点失效的关系 Evolution of solder micro-structure and interface intermetallics and effects on solder joint lifetime
• 影响焊点寿命的典型设计、工艺、材料等因素 Typical design, material, process parameters affecting soldering joint lifetime
• 焊点失效分析流程 Typical flow chart for solder joint failure analysis
• 焊点失效典型模式及分析方法 Typical failure modes and analy
